Intel has just revealed a glimpse of the Intel Lakefield SOC which comes with 10nm Sunny Cove and Gen 11 graphics. The chip has been designed to deliver more power and be more power efficient as well. The benchmarks of the Gen 11 graphics have been leaked and we have seen that the performance is much higher than previous integrated graphics solutions and even some AMD offerings.
The Intel Lakefield SOC is the first of its kind to use 3D integration which allows the company to cram more hardware and power into a smaller space. This will allow devices to be more portable, thin and mobile. That is why the whole SOC is just 12×12mm or 144mm2.
At CES 2019, Intel previewed a new client platform, code-named “Lakefield,” featuring the first iteration of its new innovative Foveros 3D packaging technology. This hybrid CPU architecture enables combining different pieces of IP that might have previously been discrete into a single product with a smaller motherboard footprint, which allows OEMs more flexibility for thin and light form factor design. Lakefield is expected to be in production this year.
You can learn more about the Intel Lakefield SOC in the video included below:
The Intel Lakefield SOC has 4 layers of dies stack on top of each other and each layer has its own purpose. The two top layers have the DRAM. The SOC does not need socketed DRAM that is why the motherboard can be smaller and space can be used to devices even smaller.
The SOC has a larger CPU core and other smaller cores as well. All of these are based on the 10nm process and should over significantly better performance as compared to what we have seen in the past.
Intel is also working on making chips that do not have a graphics part in order to keep up with demand and the company is also going to launch a discrete graphics solution in 2020.
Let us know what you think about the Intel Lakefield SOC and whether or not you would be interested in buying a device powered by this solution.
