Intel’s Next-Gen Alder Lake CPU Pictured with LGA 1700 Socket, Rectangular PCB

Intels Alder Lake

The very first pictures of Intel’s next-generation ‘Alder Lake’ Desktop processors have surfaced online. The pictures were posted in a leak by Videocardz and show the huge changes coming to Intel’s 12th Gen CPUs which will feature a brand new LGA 1700 socket and a new platform.

Intel has confirmed that the first desktop processors based on 10nm SuperFin architecture will officially launch in the second half of 2021. Intel has so far officially confirmed that it plans to launch two brand new CPU families in 2021.

First is the LGA 1200 socket-aimed Rocket Lake lineup which would be released in Q1 2021 & the second is the LGA 1700 socket aimed Alder Lake lineup which is planned for release in the second half of 2021. The Alder Lake CPUs will be intel’s first desktop processors to feature the 10nm SuperFin Process.

Alder Lake will bring many new upgrades besides the architectural ones. Alder Lake CPUs will be the first mainstream desktop platform to feature a mix of smaller “Atom” & bigger “Core” cores which will be packaged in a PCB that would be taller than the square-shaped chips Intel has been making before. In the picture, the size differences can be seen and the Alder lake chip is quite taller than the current 10th Gen Comet Lake-S CPU.

The new chip size means that a new socket will be coming for the Alder Lake which is currently thought to be named as LGA 1700 socket. The new dimensions would mean that Alder Lake CPUs and all future CPUs would no longer be compatible with the existing socket layouts. The backside of the PCB still features a land grid array pin layout and there are a total of 1700 gold contact pads while a large array of caps can be seen fused in the middle of the PCB.

We will have to wait for more information to see what Intel is going to bring with its Alder Lake CPUs.

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About the Author: Talal Waseem

Talal Waseem is an avid gamer and a hardware content contributor at GamesHedge.

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